====== Passive components at cryogenic temperatures ======

===== Resistor =====
Metal Thin Film resistors are very temperature stable. \cite{Homulle:2019}

^ Susumu, RR1220P-104-D | 100kOhm | \cite{Cahall.Gauthier.ea:2018}, \cite{Lamb:2014} |
^ Susumu, RR1220P-101-D | 100 Ohm | \cite{Cahall.Gauthier.ea:2018}, \cite{Lamb:2014} |
^ Vishay, FC0603E50R0BST1 | 50 Ohm | \cite{Homulle:2019} |
^ Panasonic ERA-3AEB4990V | 499 Ohm | \cite{Homulle:2019} |

Literature:
  * Table of characterized components: \cite{Lamb:2014}

===== Inductor =====
^ Epcos, B82496C3221J000 | 220nH | \cite{Cahall.Gauthier.ea:2018} |
^ Taiyo Yuden chip inductor (0402) | 2.28uH (1.37uH, 1 Ohm @ 4K) | \cite{Buchanan.Benford.ea:2012} |
===== Capacitor =====
Foil capacitors (e.g. ECPU, ECHU and PPS) reduced their capacitance significantly at cryogenic temperatures. NP0 capacitors show little change of capacitance during cooling. \cite{Pan:2005}

Below 1uF NP0/C0G and Acrylic Film are the way to go, above tantalum polymer capactitors.\cite{Homulle:2019}

^ Kemet, C0805C473J3GACTU | 0.047uF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 11pF$ | \cite{PaqueletWuetz.Bavdaz.ea:2020} |
^ Kemet, C0603C153J3GACTU | 0.015µF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 2pF$ | \cite{PaqueletWuetz.Bavdaz.ea:2020} |
^ Kemet, C0402C101J5GACTU | 100pF, Ceramic capacitor | \cite{PaqueletWuetz.Bavdaz.ea:2020} |
^ Vishay Vitramon, VJ0603A101KXBAC31 | 100pF | \cite{Cahall.Gauthier.ea:2018} |

Literature:
  * Table of characterized components: \cite[Table 2.1]{Homulle:2019} Table 2.1