====== Passive components at cryogenic temperatures ======

===== Resistor =====
Metal Thin Film resistors are very temperature stable. {[Homulle:2019]}

^ Susumu, RR1220P-104-D | 100kOhm | {[Cahall.Gauthier.ea:2018]}, {[Lamb:2014]} |
^ Susumu, RR1220P-101-D | 100 Ohm | {[Cahall.Gauthier.ea:2018]}, {[Lamb:2014]} |
^ Vishay, FC0603E50R0BST1 | 50 Ohm | {[Homulle:2019]} |
^ Panasonic ERA-3AEB4990V | 499 Ohm | {[Homulle:2019]} |

Literature:
  * Table of characterized components: {[Lamb:2014]}

===== Inductor =====
^ Epcos, B82496C3221J000 | 220nH | {[Cahall.Gauthier.ea:2018]} |
^ Taiyo Yuden chip inductor (0402) | 2.28uH (1.37uH, 1 Ohm @ 4K) | {[Buchanan.Benford.ea:2012]} |
===== Capacitor =====
Foil capacitors (e.g. ECPU, ECHU and PPS) reduced their capacitance significantly at cryogenic temperatures. NP0 capacitors show little change of capacitance during cooling. {[Pan:2005]}

Below 1uF NP0/C0G and Acrylic Film are the way to go, above tantalum polymer capactitors.{[Homulle:2019]}

^ Kemet, C0805C473J3GACTU | 0.047uF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 11pF$ | {[PaqueletWuetz.Bavdaz.ea:2020]} |
^ Kemet, C0603C153J3GACTU | 0.015µF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 2pF$ | {[PaqueletWuetz.Bavdaz.ea:2020]} |
^ Kemet, C0402C101J5GACTU | 100pF, Ceramic capacitor | {[PaqueletWuetz.Bavdaz.ea:2020]} |
^ Vishay Vitramon, VJ0603A101KXBAC31 | 100pF | {[Cahall.Gauthier.ea:2018]} |

Literature:
  * Table of characterized components: \cite[Table 2.1]{Homulle:2019} Table 2.1

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