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topic:engineering:cryogenics:electronics:passive-components
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| topic:engineering:cryogenics:electronics:passive-components [2021/03/23 20:18] – samuel | topic:engineering:cryogenics:electronics:passive-components [2021/03/23 22:08] (current) – [Capacitor] samuel | ||
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| ===== Capacitor ===== | ===== Capacitor ===== | ||
| Foil capacitors (e.g. ECPU, ECHU and PPS) reduced their capacitance significantly at cryogenic temperatures. NP0 capacitors show little change of capacitance during cooling. \cite{Pan: | Foil capacitors (e.g. ECPU, ECHU and PPS) reduced their capacitance significantly at cryogenic temperatures. NP0 capacitors show little change of capacitance during cooling. \cite{Pan: | ||
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| + | Below 1uF NP0/C0G and Acrylic Film are the way to go, above tantalum polymer capactitors.\cite{Homulle: | ||
| ^ Kemet, C0805C473J3GACTU | 0.047uF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 11pF$ | \cite{PaqueletWuetz.Bavdaz.ea: | ^ Kemet, C0805C473J3GACTU | 0.047uF, Ceramic capacitor, used as decoupling capacitor, cold they have $\approx 11pF$ | \cite{PaqueletWuetz.Bavdaz.ea: | ||
topic/engineering/cryogenics/electronics/passive-components.1616530693.txt.gz · Last modified: by samuel
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