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topic:engineering:cryogenics:electronics
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| topic:engineering:cryogenics:electronics [2021/02/24 09:15] – samuel | topic:engineering:cryogenics:electronics [2021/09/14 12:14] (current) – [Literature & External Links] samuel | ||
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| Line 19: | Line 19: | ||
| * Tin/lead solder works fine, but lead-free solder likely also will work. | * Tin/lead solder works fine, but lead-free solder likely also will work. | ||
| - | ===== Literature | + | ===== Literature |
| - | | + | |
| - | ===== External | + | |
| * [[https:// | * [[https:// | ||
| + | * PhD Thesis - Cern - \cite{Kaltenbacher: | ||
| + | * PhD Thesis - Delft - The beginning chapters are quite useful as reference. \cite{Homulle: | ||
| + | * Different electronic materials at 4K \cite{Fink.Fabing.ea: | ||
| + | * Commercial electronics for cryogenic use. \cite{Buchanan.Benford.ea: | ||
topic/engineering/cryogenics/electronics.1614158140.txt.gz · Last modified: by samuel
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